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october 2010 doc id 16273 rev 7 1/34 1 vnd5e025bk-e double channel high-side driver with analog current sense for automotive applications features general ? inrush current active management by power limitation ? very low standby current ? 3.0v cmos compatible inputs diagnostic functions ? high current sense precision for wide currents range ? current sense ratio drift for single point calibration ? current sense disable ? overload and short to ground (power limitation) indication ? thermal shutdown indication protections ? undervoltage shutdown ? overvoltage clamp ? load current limitation ? self limiting of fast thermal transients ? protection against loss of ground and loss of v cc ? overtemperature shutdown with auto restart (thermal shutdown) ? reverse battery protected ? electrostatic discharge protection applications especially intended for blinkers all types of resistive, inductive and capacitive loads and suitable as led driver description the vnd5e025bk-e is a double channel high- side driver manufactured in the st proprietary vipower? m0-5 technology and housed in the tiny powersso-24 package. the vnd5e025bk-e is designed to drive 12v automotive grounded loads delivering protection, diagnostics and easy 3v and 5v cmos compatible interface with any microcontroller. the device integrates advanced protective functions such as load cu rrent limitatio n, inrush and overload active management by power limitation, overtemperature shut-off with auto restart and overvoltage active clamp. a dedicated analog current sense pin is associated with every output channel in order to provide enhanced diagnostic functions including fast detection of overload and short circuit to ground through power limitation indication and overtemperature indication. an improved current sense circuitry and the introduction of a new current sense ratio drift, dk/k(tot), allow the "single-point" calibration and ensure a very high accuracy in case of "double- point" calibration. the current sensing and diagnostic feedback of the whole device can be disabled by pulling the cs_dis pin high to allow sharing of the external sense resistor with other similar devices. max transient supply voltage v cc 41 v operating voltage range v cc 4.5 to 28 v max on-state resist ance (per ch.) r on 25 m current limitation (typ) i limh 60 a off-state supply current i s 2a (1) 1. typical value with all loads connected. powersso-24 www.st.com
contents vnd5e025bk-e 2/34 doc id 16273 rev 7 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.5 electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.1 gnd protection network against reverse battery . . . . . . . . . . . . . . . . . . . 22 3.1.1 solution 1: resistor in the ground line (rgnd only) . . . . . . . . . . . . . . . . 22 3.1.2 solution 2: diode (dgnd) in the ground line . . . . . . . . . . . . . . . . . . . . . 23 3.2 load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.3 mcu i/os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.4 current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.5 maximum demagnetization energy (vcc = 13.5v) . . . . . . . . . . . . . . . . . 25 4 package and thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.1 powersso-24 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 5 package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.1 ecopack ? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.2 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.3 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 6 order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
vnd5e025bk-e list of tables doc id 16273 rev 7 3/34 list of tables table 1. pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 table 2. suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6 table 3. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 4. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 5. power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 6. switching (vcc = 13v; tj = 25c) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 7. logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 8. protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 9. current sense (8v < vcc < 18v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 10. truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 11. electrical transient requirements (part 1/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 12. electrical transient requirements (part 2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 13. electrical transient requirements (part 3/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 14. thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 table 15. powersso-24 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 table 16. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 table 17. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
list of figures vnd5e025bk-e 4/34 doc id 16273 rev 7 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 3. current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 4. current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 5. switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 6. output voltage drop limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 7. delay response time between rising edge of output current and rising edge of current sense (cs enabled). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 8. i out /i sense vs i out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 9. maximum current sense ratio drift vs load current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 10. normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 11. overload or short to gnd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 12. intermittent overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 13. t j evolution in overload or short to gnd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 14. off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 15. high level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 16. input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 17. input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 18. input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 19. input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 20. on-state resistance vs tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 21. on-state resistance vs vcc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 22. undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 23. ilimh vs tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 24. turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 25. turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 26. cs_dis high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 27. cs_dis low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 28. cs_dis clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 29. application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 figure 30. current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 figure 31. maximum turn-off current versus inductance (for each channel) . . . . . . . . . . . . . . . . . . . . 25 figure 32. powersso-24 pc board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 figure 33. rthj-amb vs pcb copper area in open box free air condition (one channel on) . . . . . . . . . 26 figure 34. powersso-24 thermal impedance junction to ambient single pulse (one channel on) . . . 27 figure 35. thermal fitting model of a double channel hsd in powersso-24 . . . . . . . . . . . . . . . . . . . 27 figure 36. powersso-24 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 figure 37. powersso-24 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 figure 38. powersso-24 tape and reel shipment (suffix ?tr?) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
vnd5e025bk-e block diagram and pin description doc id 16273 rev 7 5/34 1 block diagram and pin description figure 1. block diagram table 1. pin functions name function v cc battery connection. output 1,2 power output. gnd ground connection. must be reverse battery protected by an external diode / resistor network. input 1,2 voltage controlled input pin with hyst eresis, cmos compatible. controls output switch state. current sense 1,2 analog current sense pin; delivers a current proportional to the load current. cs_dis active high cmos compatible pin to disable the current sense pin. v cc ch 1 control & diagnostic 1 logic driver v on limitation current limitation power clamp over temp. undervoltage v senseh current sense ch 2 overload protection (active power limitation) in1 in2 cs1 cs2 cs_ dis gnd out2 out1 signal clamp control & diagnostic channels 2
block diagram and pin description vnd5e025bk-e 6/34 doc id 16273 rev 7 figure 2. configurati on diagram (top view) table 2. suggested connections for unused and not connected pins connection / pin current sense n.c. output input cs_dis floating not allowed x x x x to ground through 1 k resistor x through 22 k resistor through 10 k resistor through 10 k resistor 1 2 3 4 5 6 n.c. input1 gnd v cc n.c. input2 7 8 9 10 11 12 cs_dis. v cc current sense1 n.c. n.c. current sense2 24 23 22 21 20 19 output2 output2 output2 output2 output2 output2 18 17 16 15 14 13 output1 output1 output1 output1 output1 output1 tab = v cc
vnd5e025bk-e electrical specification doc id 16273 rev 7 7/34 2 electrical specification figure 3. current and voltage conventions 2.1 absolute maximum ratings stressing the device above the rating listed in the ?absolute maximum ratings? table may cause permanent damage to the device. these are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implie d. exposure to the conditions in table below for extended periods may affect device reliability. refer al so to the stmicroelectronics sure program and other relevant quality document. v fn i s i gnd v cc v cc v sense2 output1 i out1 current i sense1 input1 i in1 v in2 v out2 gnd cs_dis i csd v csd input2 i in2 v in1 sense1 output2 i out2 current i sense2 sense2 v sense1 v out1 note: v fn = v outn - v cc during reverse battery condition. table 3. absolute maximum ratings symbol parame ter value unit v cc dc supply voltage 41 v -v cc reverse dc supply voltage 0.3 -i gnd dc reverse ground pin current 200 ma i out dc output current internally limited a - i out reverse dc output current 24 i in dc input current -1 to 10 ma i csd dc current sense disable input current -i csense dc reverse cs pin current 200 v csense current sense maximum voltage v cc - 41 to +v cc v
electrical specification vnd5e025bk-e 8/34 doc id 16273 rev 7 2.2 thermal data e max maximum switching energy (single pulse) (l = 0.8 mh; r l =0 ; v bat = 13.5 v; t jstart = 150 c; i out = i liml (typ.)) 140 mj v esd electrostatic discharge (human body model: r = 1.5 k ; c = 100 pf) ? input ? current sense ?cs_dis ? output ?v cc 4000 2000 4000 5000 5000 v v v v v v esd charge device model (cdm-aec-q100-011) 750 v t j junction operating temperature - 40 to 150 c t stg storage temperature - 55 to 150 table 3. absolute maximum ratings (continued) symbol parame ter value unit table 4. thermal data symbol parameter m ax. value unit r thj-case thermal resistance junction-case (with one channel on) 1.35 c/w r thj-amb thermal resistance junction-ambient see figure 33
vnd5e025bk-e electrical specification doc id 16273 rev 7 9/34 2.3 electrical characteristics values specified in th is section are for 8v electrical specification vnd5e025bk-e 10/34 doc id 16273 rev 7 table 7. logic inputs symbol parameter test cond itions min. typ. max. unit v il input low level voltage 0.9 v i il low level input current v in =0.9v 1 a v ih input high level voltage 2.1 v i ih high level input current v in =2.1v 10 a v i(hyst) input hysteresis voltage 0.25 v v icl input clamp voltage i in =1ma 5.5 7 i in = -1ma -0.7 v csdl cs_dis low level voltage 0.9 i csdl low level cs_dis current v csd =0.9v 1 a v csdh cs_dis high level voltage 2.1 v i csdh high level cs_dis current v csd =2.1v 10 a v csd(hyst) cs_dis hysteresis voltage 0.25 v v cscl cs_dis clamp voltage i csd =1ma 5.5 7 i csd =-1ma -0.7 table 8. protections and diagnostics (1) 1. to ensure long term reliability under heavy overload or s hort circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. if the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles. symbol parameter test conditions min. typ. max. unit i limh dc short circuit current v cc = 13v 43 60 85 a 5v < v cc < 28v i liml short circuit current during thermal cycling v cc = 13v; t r vnd5e025bk-e electrical specification doc id 16273 rev 7 11/34 table 9. current sense (8v < v cc < 18v) symbol parameter test conditions min. typ. max. unit k led i out /i sense i out = 0.05a; v sense =0.5v; v csd =0v; t j = -40c to 150c 1922 5046 9218 k 1 i out /i sense i out = 1.5 a; v sense =4 v; v csd =0v; t j = -40c to 150c 2460 3363 4050 dk 1 /k 1 (1)(2) current sense ratio drift i out = 1.5 a; v sense =4 v; v csd =0v; t j = -40c to 150c -9 9 % k 2 i out /i sense i out =2 a; v sense =4v; v csd =0v; t j = -40c to 150c 2550 3405 4108 dk 2 /k 2 (1)(2) current sense ratio drift i out =2 a; v sense =4v; v csd =0v; t j = -40c to 150c -7 7 % k 3 i out /i sense i out = 2.4 a; v sense =4v; v csd =0v; t j = -40c to 150c 2635 3384 4117 dk 3 /k 3 (1)(2) current sense ratio drift i out = 2.4 a; v sense =4v; v csd =0v; t j = -40c to 150c -6 +6 % k4 i out /i sense i out =3 a; v sense =4v; v csd =0v; t j = -40c to 150c 2752 3368 3975 dk 4 /k 4 (1)(2) current sense ratio drift i out =3 a; v sense =4v; v csd =0v; t j = -40c to 150c -5 5 % k 5 i out /i sense i out =4 a; v sense =4v; v csd =0v; t j = -40c to 150c 2860 3341 3805 dk 5 /k 5 (1)(2) current sense ratio drift i out =4 a; v sense =4v; v csd =0v; t j = -40c to 150c -4 4 % k 6 i out /i sense i out =10 a; v sense =4v; v csd =0v; t j = -40c to 150c 2965 3307 3570 dk 6 /k 6 (1)(2) current sense ratio drift i out =10 a; v sense =4v; v csd =0v; t j = -40c to 150c -3 3 % dk/k (tot) (1)(3) current sense ratio drift for single point calibration measurement point: i out = 2.4 a; t j = 25c; v cc = 13.5v -9.5 -7 -6 -7 -8 9.5 7 6 7 8 % % % % % i out =1.5a i out =2.0a i out =2.4a i out =3.0a i out =4.0a
electrical specification vnd5e025bk-e 12/34 doc id 16273 rev 7 i sense 0 analog sense leakage current i out =0a; v sense =0v; v csd =5v; v in =0v; t j = -40c to 150c v csd =0v; v in =5v; t j = -40c to 150c i out =2a; v sense =0v; v csd =5v; v in =5v; t j = -40c to 150c 0 0 0 1 2 1 a a a i ol openload on- state current detection threshold v in = 5v, 8v vnd5e025bk-e electrical specification doc id 16273 rev 7 13/34 figure 4. current sense delay characteristics figure 5. switching characteristics figure 6. output voltage drop limitation sense current input load current cs_dis t dsense2h t dsense2l t dsense1l t dsense1h v out dv out /dt (on) t r 80% 10% t f dv out /dt (off) t d(off) t d(on) input t t 90% t won t woff v on i out v cc -v out t j =150 o c t j =25 o c t j =-40 o c v on /r on(t)
electrical specification vnd5e025bk-e 14/34 doc id 16273 rev 7 figure 7. delay response time between rising edge of output current and rising edge of current sense (cs enabled) figure 8. i out /i sense vs i out v in i out i sense i outmax i sensemax 90% i sensemax 90% i outmax t dsense2h t t t k 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200 1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5 iout (a) k(min) k(max)
vnd5e025bk-e electrical specification doc id 16273 rev 7 15/34 figure 9. maximum current sense ratio drift vs load current table 10. truth table conditions input output sense (v csd =0v) (1) 1. if the v csd is high, the sense output is at a high impedance, its potential depends on leakage currents and external circuit. normal operation l h l h 0 nominal overtemperature l h l l 0 v senseh undervoltage l h l l 0 0 overload h h x (no power limitation) cycling (power limitation) nominal v senseh short circuit to gnd (power limitation) l h l l 0 v senseh negative output voltage clamp ll0 dk/k -10% -8% -6% -4% -2% 0% 2% 4% 6% 8% 10% 1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5 iout (a) dk/k(min) dk/k(max) note: parameter guaranteed by design; it is not tested.
electrical specification vnd5e025bk-e 16/34 doc id 16273 rev 7 table 11. electrical transient requirements (part 1/3) iso 7637-2: 2004(e) test pulse test levels (1) 1. the above test levels must be considered referred to v cc = 13.5v except for pulse 5b. number of pulses or test times burst cycle / pulse repetition time delays and impedance iii iv min. max. 1 -75v -100v 5000 pulses 0.5s 5s 2 ms, 10 2a +37v +50v 5000 pulses 0.2s 5s 50s, 2 3a -100v -150v 1h 90ms 100ms 0.1s, 50 3b +75v +100v 1h 90ms 100ms 0.1s, 50 4 -6v -7v 1 pulse 100ms, 0.01 5b (2) 2. valid in case of external load dump clamp: 40v maximum referred to ground. +65v +87v 1 pulse 400ms, 2 table 12. electrical transient requirements (part 2/3) iso 7637-2: 2004e test pulse test level results iii vi 1c c 2a c c 3a c c 3b c c 4c c 5b (1) 1. valid in case of external load dump clamp: 40v maximum referred to ground. cc table 13. electrical transient requirements (part 3/3) class contents c all functions of the device performed as designed after exposure to disturbance. e one or more functions of the device did not perform as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device.
vnd5e025bk-e electrical specification doc id 16273 rev 7 17/34 2.4 waveforms figure 10. normal operation figure 11. overload or short to gnd i out v sense v cs_dis input nominal load nominal load normal operation power limitation i limh > i liml > i out v sense v cs_dis input thermal cycling overload or short to gnd
electrical specification vnd5e025bk-e 18/34 doc id 16273 rev 7 figure 12. intermittent overload figure 13. t j evolution in overload or short to gnd i out v sense v cs_dis input i limh > nominal load intermittent overload i liml > overload v senseh > t tsd t r t j evolution in overload or short to gnd i limh > < i liml t j_start t hyst power limitation self-limitation of fast thermal transients input i out t j
vnd5e025bk-e electrical specification doc id 16273 rev 7 19/34 2.5 electrical char acteristics curves figure 14. off-state output current figure 15. high level input current figure 16. input clamp voltage figure 17. input high level figure 18. input low level figure 19. input hysteresis voltage -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 100 200 300 400 500 600 700 800 900 1000 iloff (na) off state vcc=13v vin=vout=0v -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 5 iih (a) vin = 2.1v v cc = 8 v -50 -25 0 25 50 75 100 125 150 175 tc (c) 5 5,2 5,4 5,6 5,8 6 6,2 6,4 6,6 6,8 7 vicl (v) lin=1ma -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0,5 1 1,5 2 2,5 3 3,5 4 vih (v) -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 vil (v) -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 vihyst (v)
electrical specification vnd5e025bk-e 20/34 doc id 16273 rev 7 figure 20. on-state resistance vs t case figure 21. on-state resistance vs v cc figure 22. undervoltage shutdown figure 23. i limh vs t case figure 24. turn-on voltage slope figure 25. turn-off voltage slope -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 10 20 30 40 50 60 70 ron (mohm) iout= 3a vcc=13v 0 5 10 15 20 25 30 35 40 vcc (v) 0 10 20 30 40 50 60 ron (mohm) tc=-40c tc=25c tc=125c tc=150c -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 2 4 6 8 10 12 14 16 vusd (v) -50 -25 0 25 50 75 100 125 150 175 tc (c) 40 45 50 55 60 65 70 ilimh (a) vcc=13v -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 100 200 300 400 500 600 700 (dvout/dt )on (v/ms) vcc=13v ri=4.3 ohm -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 100 200 300 400 500 600 (dvout/dt )off (v/ms) vcc=13v ri= 4.3 ohm
vnd5e025bk-e electrical specification doc id 16273 rev 7 21/34 figure 26. cs_dis high level voltage f igure 27. cs_dis low level voltage figure 28. cs_dis clamp voltage -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0,5 1 1,5 2 2,5 3 3,5 4 vcsdh (v) -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0,5 1 1,5 2 2,5 3 vcsdl (v) -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 1 2 3 4 5 6 7 8 9 10 vcsdcl(v) icsd = 1 ma
application information vnd5e025bk-e 22/34 doc id 16273 rev 7 3 application information figure 29. application schematic 3.1 gnd protection network against reverse battery this section provides two solutions for implementing a ground protection network against reverse battery. 3.1.1 solution 1: resist or in the ground line (r gnd only) this can be used with any type of load. the following is an indication on how to dimension the r gnd resistor. 1. r gnd 600 mv / (i s(on)max ) 2. r gnd (? v cc ) / (-i gnd ) where -i gnd is the dc reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. power dissipation in r gnd (when v cc <0: during reverse battery situations) is: p d = (-v cc ) 2 /r gnd this resistor can be shared amongst several different hsds. please note that the value of this resistor should be calculated with formula (1) where i s(on)max becomes the sum of the maximum on-state currents of the different devices. please note that if the microprocessor ground is not shared by the device ground then the r gnd will produce a shift (i s(on)max * r gnd ) in the input thresholds and the status output v cc gnd output d gnd r gnd d ld cu +5v v gnd cs_dis input r prot r prot current sense r sense r prot c ext note: channel 2 has the same internal circuit as channel 1.
vnd5e025bk-e application information doc id 16273 rev 7 23/34 values. this shift will vary depending on how ma ny devices are on in the case of several high-side drivers sharing the same r gnd . if the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then st suggests to utilize solution 2 (see below). 3.1.2 solution 2: diode (d gnd ) in the ground line a resistor (r gnd =1 k ) should be inserted in parallel to d gnd if the device drives an inductive load. this small signal diode can be safely shared amongst several different hsds. also in this case, the presence of the grou nd network will produce a shift ( 600mv) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. this shift will not vary if more than one hsd shares t he same diode/resistor network. 3.2 load dump protection d ld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the v cc max dc rating. the same applies if the device is subject to transients on the v cc line that are greater than the ones shown in the iso 7637-2: 2004(e) table. 3.3 mcu i/os protection if a ground protection network is used and negative transient are present on the v cc line, the control pins will be pulled negative. st suggests to insert a resistor (r prot ) in line to prevent the mcu i/os pins to latch-up. the value of these resistors is a compromise between the leakage current of mcu and the current required by the hsd i/o s (input levels compatibility) with the latch-up limit of mcu i/os: -v ccpeak /i latchup r prot (v oh c -v ih -v gnd ) / i ihmax calculation example: for v ccpeak = - 100 v and i latchup 20 ma; v ohc 4.5 v 5k r prot 180 k recommended values: r prot =10 k , c ext =10 nf.
application information vnd5e025bk-e 24/34 doc id 16273 rev 7 3.4 current sense and diagnostic the current sense pin performs a double function (see figure 30: current sense and diagnostic ): current mirror of the load cu rrent in normal operation, delivering a current proportional to the load one according to a known ratio k x . the current i sense can be easily converted to a voltage v sense by means of an external resistor r sense . linearity between i out and v sense is ensured up to 5v minimum (see parameter v sense in table 9: current sense (8v < vcc < 18v) ). the current sense accuracy depends on the output current (refer to current sense electrical characteristics table 9: current sense (8v < vcc < 18v) ). diagnostic flag in fault conditions , delivering a fixed voltage v senseh up to a maximum current i senseh in case of the following fault conditions (refer to tr u t h t a b l e ): ? power limitation activation ?overtemperature a logic level high on cs_dis pin sets at the same time all the current sense pins of the device in a high impedance state, thus disabling the current monitoring and diagnostic detection. this feature allows multiplexing of the microcontroller analog inputs by sharing of sense resistance and adc line among different devices. figure 30. current sense and diagnostic v cc ch 1 control & di agnosti c 1 logic dri ver v o n lim itation current li m itation power cl am p ov er tem p. undervoltage v senseh current sense ch 2 overload protecti on ( acti ve pow er li m itation ) in1 in2 cs1 cs2 cs_ di s gnd out2 out1 si gnal clam p control & diagnostic channels 2
vnd5e025bk-e application information doc id 16273 rev 7 25/34 3.5 maximum demagnetization energy (v cc =13.5v) figure 31. maximum turn-off current versus inductance (for each channel) 1 10 100 0,1 1 10 100 l (mh) i (a) demagnetization demagnetization demagnetization t v in , i l c: t jstart = 125c repetitive pulse a: t jstart = 150c single pulse b: t jstart = 100c repetitive pulse a b c note: values are generated with r l =0 . in case of repetitive pulses, t jstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves a and b.
package and thermal data vnd5e025bk-e 26/34 doc id 16273 rev 7 4 package and thermal data 4.1 powersso-24 thermal data figure 32. powersso-24 pc board figure 33. r thj-amb vs pcb copper area in open box free air condition (one channel on) note: layout condition of r th and z th measurements (pcb: double layer, thermal vias, fr4 area = 77mm x 86mm, pcb thickness = 1.6mm, cu thickness = 70m (front and back side), copper areas: from minimum pad layout to 8cm 2 ). 30 35 40 45 50 55 0246810 rthj_amb(c/w) pcb cu heatsink area (cm^2)
vnd5e025bk-e package and thermal data doc id 16273 rev 7 27/34 figure 34. powersso-24 thermal impedance junction to ambient single pulse (one channel on) equation 1: pulse calculation formula where = t p /t figure 35. thermal fitting model of a double channel hsd in powersso-24 0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zth (c/w) footprint 8 cm 2 2 cm 2 z th r th z thtp 1 ? () + ? = note: the fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
package and thermal data vnd5e025bk-e 28/34 doc id 16273 rev 7 table 14. thermal parameters area/island (cm 2 ) footprint 2 8 r1 (c/w) 0.28 r2 (c/w) 0.9 r3 (c/w) 6 r4 (c/w) 7.7 r5 (c/w) 9 9 8 r6 (c/w) 28 17 10 r7 (c/w) 0.28 r8 (c/w) 0.9 c1 (w.s/c) 0.001 c2 (w.s/c) 0.003 c3 (w.s/c) 0.025 c4 (w.s/c) 0.75 c5 (w.s/c) 1 4 9 c6 (w.s/c) 2.2 5 17 c7 (w.s/c) 0.001 c8 (w.s/c) 0.003
vnd5e025bk-e package and packing information doc id 16273 rev 7 29/34 5 package and packing information 5.1 ecopack ? in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 5.2 package mechanical data figure 36. powersso-24 package dimensions
package and packing information vnd5e025bk-e 30/34 doc id 16273 rev 7 5.3 packing information figure 37. powersso-24 tube shipment (no suffix) table 15. powersso-24 mechanical data symbol millimeters min. typ. max. a 2.15 2.47 a2 2.15 2.40 a1 0 0.075 b 0.33 0.51 c 0.23 0.32 d 10.10 10.50 e7.4 7.6 e0.8 e3 8.8 g 0.1 g1 0.06 h 10.1 10.5 h 0.4 k5 l 0.55 0.85 n 10 x4.1 4.7 y6.5 7.1 a c b all dimensions are in mm. base qty 49 bulk qty 1225 tube length (0.5) 532 a 3.5 b 13.8 c (0.1) 0.6
vnd5e025bk-e package and packing information doc id 16273 rev 7 31/34 figure 38. powersso-24 tape and reel shipment (suffix ?tr?) base qty 1000 bulk qty 1000 a (max) 330 b (min) 1.5 c (0.2) 13 f 20.2 g (+2 / -0) 24.4 n (min) 100 t (max) 30.4 reel dimensions tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb. 1986 all dimensions are in mm. tape width w 24 tape hole spacing p0 (0.1) 4 component spacing p 12 hole diameter d (0.05) 1.55 hole diameter d1 (min) 1.5 hole position f (0.1) 11.5 compartment depth k (max) 2.85 hole spacing p1 (0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets sealed with cover tape. user direction of feed
order codes vnd5e025bk-e 32/34 doc id 16273 rev 7 6 order codes table 16. device summary package order codes tube tape and reel powersso-24 vnd5e025bk-e VND5E025BKTR-E
vnd5e025bk-e revision history doc id 16273 rev 7 33/34 7 revision history table 17. document revision history date revision changes 17-sep-2009 1 initial release. 02-nov-2009 2 updated table 5: power section . 30-nov-2009 3 updated table 9: current sense (8v < vcc < 18v) . updated figure 9: maximum current sense ratio drift vs load current 21-jan-2010 4 updated table 9: current sense (8v < vcc < 18v) 03-feb-2010 5 updated following tables: ? table 6: switching (vcc = 13v; tj = 25c) ? table 9: current sense (8v < vcc < 18v) updated following figures: ? figure 8: iout/isense vs iout ? figure 9: maximum current sense ratio drift vs load current 19-feb-2010 6 updated table 6: switching (vcc = 13v; tj = 25c) . 11-oct-2010 7 changed document status from target specification to datasheet.
vnd5e025bk-e 34/34 doc id 16273 rev 7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in military , air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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